A variational model for fracture and debonding of thin films under in-plane loadings
We study fracture and debonding of a thin stiff film bonded to a rigid substrate through a thin compliant layer, introducing a two-dimensional variational fracture model in brittle elasticity. Fractures are naturally distinguished between transverse cracks in the film (curves in 2D) and debonded sur...
| Autores principales: | , , , , |
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| Formato: | Artículo (Article) |
| Idioma: | Inglés (English) |
| Publicado: |
2025
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| Materias: | |
| Acceso en línea: | https://repositorio.uc.cl/handle/11534/101665 |